Systems-Level Packaging for Millimeter-Wave Transceivers

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Éditeur :

Springer


Collection :

Smart Sensors, Measurement and Instrumentation

Paru le : 2019-03-26

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Description

This book provides a system-level approach to making packaging decisions for millimeter-wave transceivers. In electronics, the packaging forms a bridge between the integrated circuit or individual device and the rest of the electronic system, encompassing all technologies between the two. To be able to make well-founded packaging decisions, researchers need to understand a broad range of aspects, including: concepts of transmission bands, antennas and propagation, integrated and discrete package substrates, materials and technologies, interconnects, passive and active components, as well as the advantages and disadvantages of various packages and packaging approaches, and package-level modeling and simulation. Packaging also needs to be considered in terms of system-level testing, as well as associated testing and production costs, and reducing costs. This peer-reviewed work contributes to the extant scholarly literature by addressing the aforementioned concepts and applying them to the context of the millimeter-wave regime and the unique opportunities that this transmission approach offers.
Pages
277 pages
Collection
Smart Sensors, Measurement and Instrumentation
Parution
2019-03-26
Marque
Springer
EAN papier
9783030146894
EAN PDF
9783030146900

Informations sur l'ebook
Nombre pages copiables
2
Nombre pages imprimables
27
Taille du fichier
9738 Ko
Prix
94,94 €
EAN EPUB
9783030146900

Informations sur l'ebook
Nombre pages copiables
2
Nombre pages imprimables
27
Taille du fichier
36250 Ko
Prix
94,94 €