Téléchargez le livre : Adhesion in Microelectronics

Adhesion in Microelectronics

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Éditeur :

Wiley-Scrivener


Collection :

Adhesion and Adhesives: Fundamental and Applied Aspects

Paru le : 2014-08-25

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Description

This comprehensive book will provide both fundamental and applied aspects of adhesion pertaining to microelectronics in a single and easily accessible source. Among the topics to be covered include; Various theories or mechanisms of adhesion Surface (physical or chemical) characterization of materials as it pertains to adhesion Surface cleaning as it pertains to adhesion Ways to improve adhesion Unraveling of interfacial interactions using an array of pertinent techniques Characterization of interfaces / interphases Polymer-polymer adhesion Metal-polymer adhesion  (metallized polymers) Polymer adhesion to various substrates Adhesion of thin films Adhesion of underfills Adhesion of molding compounds Adhesion of different dielectric materials Delamination and reliability issues in packaged devices Interface mechanics and crack propagation Adhesion measurement of thin films and coatings
Pages
368 pages
Collection
Adhesion and Adhesives: Fundamental and Applied Aspects
Parution
2014-08-25
Marque
Wiley-Scrivener
EAN papier
9781118831335
EAN PDF
9781118831359
Informations sur l'ebook
Nombre pages copiables
0
Nombre pages imprimables
368
Taille du fichier
4475 Ko
Prix
207,78 €
EAN EPUB
9781118831342
Informations sur l'ebook
Nombre pages copiables
0
Nombre pages imprimables
368
Taille du fichier
8561 Ko
Prix
207,78 €

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