Three-dimensional Integrated Circuit Design

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Éditeur :

Morgan Kaufmann


Paru le : 2010-07-28

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Description
With vastly increased complexity and functionality in the "nanometer era" (i.e. hundreds of millions of transistors on one chip), increasing the performance of integrated circuits has become a challenging task. Connecting effectively (interconnect design) all of these chip elements has become the greatest determining factor in overall performance. 3-D integrated circuit design may offer the best solutions in the near future. This is the first book on 3-D integrated circuit design, covering all of the technological and design aspects of this emerging design paradigm, while proposing effective solutions to specific challenging problems concerning the design of 3-D integrated circuits. A handy, comprehensive reference or a practical design guide, this book provides a sound foundation for the design of 3-D integrated circuits. - Demonstrates how to overcome "interconnect bottleneck" with 3-D integrated circuit design...leading edge design techniques offer solutions to problems (performance/power consumption/price) faced by all circuit designers - The FIRST book on 3-D integrated circuit design...provides up-to-date information that is otherwise difficult to find - Focuses on design issues key to the product development cycle...good design plays a major role in exploiting the implementation flexibilities offered in the 3-D - Provides broad coverage of 3-D integrated circuit design, including interconnect prediction models, thermal management techniques, and timing optimization...offers practical view of designing 3-D circuits
Pages
336 pages
Collection
n.c
Parution
2010-07-28
Marque
Morgan Kaufmann
EAN papier
9780123743435
EAN EPUB SANS DRM
9780080921860

Informations sur l'ebook
Prix
74,85 €

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