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Télécharger le livre : Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration
Xuejun Fan , John Lau
Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration
The book focuses on the design, materials, process, fabrication, failure mechanism, reliability, modeling, and thermal management of chiplets and heterogeneous integration. Both principles and engineering practice have been addressed, with more weight placed on...
Editeur : Springer
Parution : 2025-05-18

Format(s) : PDF, ePub
179,34 €
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Télécharger le livre : Solid State Lighting Reliability Part 2
Xuejun Fan , Willem Dirk Van Driel , Guo Qi Zhang
Solid State Lighting Reliability Part 2
In the past four years we have witnessed rapid development in technology and significant market penetration in many applications for LED systems. New processes and new materials have been introduced; new standards and new testing methods have been developed; new driver,...
Editeur : Springer
Parution : 2017-07-11
Collection : Solid State Lighting Technology and Application Series
Format(s) : PDF, ePub
220,49 €
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