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Télécharger le livre : Interconnect Reliability in Advanced Memory Device Packaging
Chong Leong, Gan , Chen-Yu, Huang
Interconnect Reliability in Advanced Memory Device Packaging
This book explains mechanical and thermal reliability for modern memory packaging, considering materials, processes, and manufacturing. In the past 40 years, memory packaging processes have evolved enormously.This book discusses the reliability and technical challenges...
Editeur : Springer
Parution : 2023-04-28
Collection : Springer Series in Reliability Engineering
Format(s) : PDF, ePub
210,99 €
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